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Compute-intensive + Cool
Over 8 TeraFLOPS in a single rack... 5X the GFLOPS over POWER5+
448 POWER6 processors and 3.5 TB memory in a single rack
Fourteen 2U nodes per rack
Designed to support very large clusters of
hundreds of nodes
Water cooling enables extreme performance in dense packaging...
3X the efficiency over POWER5+
Ultra-high frequency dual-core chip
►7-way superscalar, 2-way SMT core
►8 execution units
● 2LS, 2FP, 2FX, 1BR, 1VMX
►790M transistors, 341 mm2 die
►2x4MB on-chip L2 – point of coherency ►32MB On-chip L3 directory and controller
Technology
►CMOS 65nm lithography, SOI
High-speed elastic bus interface at 2:1 freq Full error checking and recovery
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