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公司介绍:叠拓信息技术有限公司 (Tieto),是一家芬兰独资的上市公司,成立于1968年,总部位于芬兰的赫尔辛基,其分支机构遍布全球30多个国家,全球员工约18000名,是北欧最大的IT服务提供商,业务领域涵盖IT研发和咨询,行业领域包括通信,林业造纸业,金融保险业,汽车、健康福利、零售、能源及其政府公共服务业。在通信研发领域,叠拓排名欧洲第一,是欧洲软件服务三大巨头之一。 在欧洲,114家全球电信网络使用我们的信令解决方案,400家报刊杂志也使用我们的IT方案,90%的移动运营商使用叠拓的IT服务。
工作地点:北京 北二环雍和宫。
薪资待遇面谈。五险一金,补充医疗保险,加班很少(有加班费),相关培训等等 和谐和人性化的工作氛围
除第一个职位因为和老外共事英文要求比较高外,其他职位英文一般即可。
请注明应聘职位,合意请发中英文简历到我邮箱shufang.wang@tieto.com
JD1: Windows Phone Device Driver developer/Team Leader
Responsibilities:
- Bring up of Windows Phone OS on new HW platform
- BSP and device driver development and debugging/problem solving at the lowest layers of the system.
Qualifications:
- BS in Computer Science (MS is a plus). 3-4+ years of relevant software development experience in C/C++
- Experience with embedded device development on Windows Mobile, WinCE or Windows Phone 7
- Experiences with BSP, drivers and kernel
- Experience working at low levels of the software stack, device driver development, and integration of HW/SW.
- Excellent debugging, problem solving, and analytical skills.
- Excellent communications skills in English and Chinese
- Ability to coach other team members
- Strong software architecture and design skills.
- The ability to work independently, but also operate as part of a team.
JD2: Software Engineer
o C++/C#
o HW Knowledge in terms of ability to understand and use HW descriptions and specifications
o Ability to read and understand the 3GPP specifications in general and the air interface in specific
o Instrument knowledge (hands on) and measurement technology
o Test and production experience within the mobile communication industry
o High skills in the following Tools:
o MS Visual Studio
o RF instrument handling
JD3: Embedded Software Engineer
o Embedded real time programming experience
o Real time system debugging tools knowledge
o HW (Hardware) knowledge in terms of ability to understand and use HW descriptions and specifications
o Test and production experience within the mobile communication industry
Instrument knowledge (hands on) and measurement technology
o Ability to read and understand the 3GPP specifications in general and the air interface in specific
o Ability to fast adaptation to system and architectures, and to solve problems on system level
o Skills of real time OS and it’s configuration
o High skills in the following Tools:
o Lauterbach debugging tool
o Eclipse
o C coding in embedded real time systems
o Real time OS experience (OSE)
o Instrument hands on experience
JD4: Android Device Driver Engineer/ Team Leader
Assignment description
Low level software development engineer:
Working for camera module and camera driver development.
Competence and role descriptions
Hold a degree in Software/Electrical Engineering.
At least 1 year experience working in mobile phone or communication design and development area.
Experience with software module structure and design/development.
Have a good understanding about hardware and communication bus (UART, I2C, SPI) and able to read and understand datasheet, schematic.
Experience on Linux, Android.
High skill in C language and Linux is mandatory.
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