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芬兰Tieto叠拓招聘Android底层/C,C++ Software Engineer [复制链接]

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发表于 2012-06-19 15:57 |只看该作者 |倒序浏览
公司介绍:叠拓信息技术有限公司 (Tieto),是一家芬兰独资的上市公司,成立于1968年,总部位于芬兰的赫尔辛基,其分支机构遍布全球30多个国家,全球员工约18000名,是北欧最大的IT服务提供商,业务领域涵盖IT研发和咨询,行业领域包括通信,林业造纸业,金融保险业,汽车、健康福利、零售、能源及其政府公共服务业。在通信研发领域,叠拓排名欧洲第一,是欧洲软件服务三大巨头之一。 在欧洲,114家全球电信网络使用我们的信令解决方案,400家报刊杂志也使用我们的IT方案,90%的移动运营商使用叠拓的IT服务。  
   
    工作地点:北京 北二环雍和宫。   
        
    薪资待遇面谈。五险一金,补充医疗保险,加班很少(有加班费),相关培训等等 和谐和人性化的工作氛围        
    除第一个职位因为和老外共事英文要求比较高外,其他职位英文一般即可。   
        
    请注明应聘职位,合意请发中英文简历到我邮箱shufang.wang@tieto.com   
        
        
    JD1: Windows Phone Device Driver developer/Team Leader   
        
    Responsibilities:   
        
    - Bring up of Windows Phone OS on new HW platform   
   - BSP and device driver development and debugging/problem solving at the lowest layers of the system.   
        
        
    Qualifications:   
        
    - BS in Computer Science (MS is a plus). 3-4+ years of relevant software development experience in C/C++   
   - Experience with embedded device development on Windows Mobile, WinCE or Windows Phone 7   
   - Experiences with BSP, drivers and kernel   
   - Experience working at low levels of the software stack, device driver development, and integration of HW/SW.   
   - Excellent debugging, problem solving, and analytical skills.   
   - Excellent communications skills in English and Chinese   
   - Ability to coach other team members   
   - Strong software architecture and design skills.   
   - The ability to work independently, but also operate as part of a team.   
        
    JD2: Software Engineer   
        
    o    C++/C#   
   o    HW Knowledge in terms of ability to understand and use HW descriptions and specifications   
   o    Ability to read and understand the 3GPP specifications in general and the air interface in specific   
   o    Instrument knowledge (hands on) and measurement technology   
   o    Test and production experience within the mobile communication industry   
   o    High skills in the following Tools:   
   o    MS Visual Studio   
   o    RF instrument handling   
        
        
    JD3: Embedded Software Engineer   
        
    o    Embedded real time programming experience   
   o    Real time system debugging tools knowledge   
   o    HW (Hardware) knowledge in terms of ability to understand and use HW descriptions and specifications   
   o    Test and production experience within the mobile communication industry   
   Instrument knowledge (hands on) and measurement technology   
   o    Ability to read and understand the 3GPP specifications in general and the air interface in specific   
   o    Ability to fast adaptation to system and architectures, and to solve problems on system level   
   o    Skills of real time OS and it’s configuration   
   o    High skills in the following Tools:   
   o    Lauterbach debugging tool   
   o    Eclipse   
   o    C coding in embedded real time systems   
   o    Real time OS experience (OSE)   
   o    Instrument hands on experience   
        
        
    JD4: Android Device Driver Engineer/ Team Leader   
        
    Assignment description   
   Low level software development engineer:   
   Working for camera module and camera driver development.   
        
    Competence and role descriptions   
   Hold a degree in Software/Electrical Engineering.   
   At least 1 year experience working in mobile phone or communication design and development area.     
    Experience with software module structure and design/development.   
   Have a good understanding about hardware and communication bus (UART, I2C, SPI) and able to read and understand datasheet, schematic.   
   Experience on Linux, Android.   
   High skill in C language and Linux is mandatory.   
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